The Semiconductor Fab Design, Engineering & Construction Summit USA 2026 is a leading semiconductor fab construction summit bringing together industry leaders in fab design, engineering, and manufacturing infrastructure in Washington, DC.
About the 7th Semiconductor Fab Design, Engineering & Construction Summit
The 7th Semiconductor Fab Design, Engineering & Construction Summit USA 2026 will take place on the 24th and 25th of June 2026 in Washington, DC.
As the United States accelerates chip manufacturing under the CHIPS and Science Act, the industry is entering a transformative era of greenfield development, large-scale construction, and technology advancement.
Our dynamic two-day event brings together industry leaders, design and engineering experts, construction specialists, and decision-makers from across the Semiconductor Fab ecosystem to address the challenges and advancements shaping the future of fab design, construction, and operations.
Attendees gain insights into the latest developments and innovative approaches to early-stage fab planning, advanced construction strategies, operational optimization, and long-term sustainability.
2
Days of Content
100+
Attendees Expected
6h+
Networking Time
Topics to BeDiscussed
Comprehensive coverage of the most critical challenges and innovations in semiconductor fab design, engineering, and construction.
01
Greenfield Fabs: Prefabrication & Modular Infrastructure
- Panelized and modular construction systems
- Prefabricated strategies for fab planning and design
- AI for predictive logistics and quality control
- DFMA integration with digital design tools
02
From BIM to Digital Twin: Future-Proof Fabs
- BIM as backbone for high-density fab infrastructure
- Transitioning from construction BIM to operational digital twin
- AI and IoT-driven Integrated Project Delivery (IPD)
- Cross-discipline design and lifecycle activities
03
Energy & Power Management in High-Density Fabs
- Managing extreme energy demand from EUV tools
- On-site microgrids and renewable energy integration
- Low-carbon nuclear solutions and SMRs for resilience
- Long-term power purchase agreements
04
Advanced UPW & Water Recycling for Next-Gen Fabs
- UPW and HUPW systems for advanced processes
- Minimal and zero liquid discharge solutions
- IoT-based water quality monitoring
- Maximizing on-site water reuse through partnerships
05
Critical Cleanroom Technologies for Operational Efficiency
- Modular wall systems for airflow, vibration, temperature
- Airborne molecular contamination (AMC) control
- Human protocols and contamination prevention
- HEPA/ULPA filtration for ultra-clean environments
06
Thermal Management: Process Cooling & Heat Recovery
- Direct-to-chip, liquid immersion, and hybrid cooling
- Waste heat recovery for energy efficiency
- AI and digital twin thermal load monitoring
- Long-term fab performance and sustainability alignment
07
HVAC & Facility Air Management: Ultra-Clean Environments
- High-efficiency HVAC for stable temperature and humidity
- HEPA/ULPA filtration and AMC control systems
- Vibration and environmental condition management
- Real-time IoT-based facilities monitoring
08
Sustainable & Fast-Track Construction
- Accelerating project delivery while maintaining quality
- Reducing carbon footprint and resource usage
- Labor, supply chain, and regulatory optimization
- Aligning construction with long-term fab operations
09
Testing, Commissioning & Startup Readiness
- Structuring commissioning for tools, utilities, cleanrooms
- Validating systems before production starts
- Integrating checklists for operational readiness
- Mitigating risks for day-one operations
Who Should Attend
C-Level Officers, VPs, Directors, Managers & Heads of:
Design
Engineering
Construction
Facility
Technology
Operations
Planning
Energy Efficiency
Sustainability
Supply Chain
Asset Management
Capital Strategy
Project Management
System / Network
Attendee Breakdown by Responsibility
28%
Executive Leadership & Corporate Strategy
27%
Facilities, Site Services & Operations Management
19%
Design, Engineering
14%
Construction, Project Management
7%
Procurement, Supply Chain & Vendor Relations
5%
Academia, Research & Industry Foundations
Industries Attending
- Semiconductor Manufacturing & Fabrication
- Integrated Device Manufacturing (IDM)
- Memory Manufacturing
- Advanced Packaging & Assembly (OSAT)
- Compound Semiconductors & Specialty Fabs
- SiC, GaN, Automotive Power Devices
- Science Parks & Industrial Development
- Semiconductor Fab Construction & EPC
- Facilities Engineering & Plant Operations
- Utilities & Infrastructure Management in Semiconductor Fabs
- Sustainability, EHS & Regulatory Compliance in Semiconductor Facilities
Attendee Breakdown by Seniority
Business Networking
Future Bridge is proud to offer ample networking opportunities during our event. The agenda includes pre-arranged 1-to-1 face meetings during a Coffee and Ice-breaking session designed to foster meaningful connections and facilitate interactions among attendees.
Mobile App for Delegate Connections
Connect with fellow delegates before, during, and after the event via the dedicated conference app.
Up to 6 Hours of Networking Breaks
Extensive dedicated networking time structured throughout both conference days.
Facilitated Peer-to-Peer Networking
Structured sessions connecting delegates with complementary interests and expertise.
Drinks Reception
Evening reception providing an informal setting to continue conversations and build lasting relationships.
Post-Event Communication
Continued connection facilitation after the event to ensure lasting value from every relationship established.
From Previous Summits
Participants will have the opportunity to engage in focused discussions, exchange ideas, and establish new relationships during both structured sessions and informal breaks throughout the two-day program.
Secure Your PlaceWhy Attend the Semiconductor Fab Design, Engineering & Construction Summit USA?
Cutting-Edge Industry Insights
Stay ahead with the latest knowledge from fab construction leaders, engineers, and semiconductor manufacturing experts shaping the future of U.S. chip production.
High-Value Networking
Connect with 100+ senior industry leaders, build strategic partnerships, and exchange ideas with C-suite executives and decision-makers across the fab ecosystem.
Expert-Led Learning
Engage in interactive sessions and panel discussions led by senior practitioners sharing real-world strategies in fab design, engineering, and construction.
CHIPS Act & Market Intelligence
Gain deep insights into market dynamics, the CHIPS and Science Act impact, and the accelerating expansion of U.S. semiconductor manufacturing capacity.
Business Networking at the Semiconductor Fab Design, Engineering & Construction Summit
Pre-Arranged 1-to-1 Meetings
Scheduled face-to-face meetings organised in advance so every conversation counts.
Coffee & Ice-Breaking Sessions
Relaxed structured sessions designed to kick-start conversations and connections on both days.
Evening Drinks Reception
An informal end-of-day reception for candid conversations and lasting professional relationships.
Post-Event Follow-Up
Delegate contact sharing and continued connection facilitation after the summit closes.
From Previous Summits
Previous Semiconductor Series Attendees
3D-Micromac America, LLCABMAmerican BIM ConstructionAmkor TechnologyAnalog DevicesApplied MaterialsArizona Commerce AuthorityArizona State UniversityASMAustin CommercialBrian Culhane Consulting EngineersCleanroom Construction AssociatesCoherent CorpCommercial Contracting CorporationDiamondback Design GroupEmpire State DevelopmentEnterprise IrelandEUV TechForesightHanmiGlobal USA, Inc.
3D-Micromac America, LLCABMAmerican BIM ConstructionAmkor TechnologyAnalog DevicesApplied MaterialsArizona Commerce AuthorityArizona State UniversityASMAustin CommercialBrian Culhane Consulting EngineersCleanroom Construction AssociatesCoherent CorpCommercial Contracting CorporationDiamondback Design GroupEmpire State DevelopmentEnterprise IrelandEUV TechForesightHanmiGlobal USA, Inc.
Hensel PhelpsHitachi EnergyIntegra TechnologiesIntelK Ensol USAKP LinkMACOM Technology SolutionsMetaMicromizeMicron TechnologyMonastic AcademyMountain West IndustrialMunters CorporationNXP SemiconductorsNY CREATESPrairie View A&M UniversityPrime Controls LPSCI FabricationSEMI FoundationSamsung Electronics
Hensel PhelpsHitachi EnergyIntegra TechnologiesIntelK Ensol USAKP LinkMACOM Technology SolutionsMetaMicromizeMicron TechnologyMonastic AcademyMountain West IndustrialMunters CorporationNXP SemiconductorsNY CREATESPrairie View A&M UniversityPrime Controls LPSCI FabricationSEMI FoundationSamsung Electronics
Sensitron SemiconductorSherwin Williams CompanySK hynix Inc.SolidigmSTMicroelectronicsSuffolkSUMCO USATexas InstrumentsThe University of Texas at AustinTSMC Arizona CorporationWolfspeedX-Fab TexasSensitron SemiconductorSherwin Williams CompanySK hynix Inc.SolidigmSTMicroelectronics
Sensitron SemiconductorSherwin Williams CompanySK hynix Inc.SolidigmSTMicroelectronicsSuffolkSUMCO USATexas InstrumentsThe University of Texas at AustinTSMC Arizona CorporationWolfspeedX-Fab TexasSensitron SemiconductorSherwin Williams CompanySK hynix Inc.SolidigmSTMicroelectronics
Previous Series Partners
JH Kelly, LLCBrandSafwayBechtel Manufacturing & TechnologyHodess CleanroomsALICE TechnologiesTECHspaceDay & ZimmermannKaeser Compressors, IncPinnacle Infotech Inc.McKinseyTranePPG Industries, Inc.HighwireRoxtec USACleanrooms WestOkland ConstructionSears Gerbo ArchitectureSMRT Architects and Engineers
JH Kelly, LLCBrandSafwayBechtel Manufacturing & TechnologyHodess CleanroomsALICE TechnologiesTECHspaceDay & ZimmermannKaeser Compressors, IncPinnacle Infotech Inc.McKinseyTranePPG Industries, Inc.HighwireRoxtec USACleanrooms WestOkland ConstructionSears Gerbo ArchitectureSMRT Architects and Engineers
Clark PacificGarney ConstructionCarlisle Construction MaterialsHBC-US INCDoxel, Inc.Boulder AssociatesCupixATS Products, IncMayair IncSchneider Electric IT CorpSourceBlue LLCFluor Enterprises IncCamfil Clean Air SolutionsPiller Power Systems Inc.Hexagon Lifecycle IntelligenceArcadisABBSiemens Smart InfrastructureElectraMetCFO ServicesVictaulic
Clark PacificGarney ConstructionCarlisle Construction MaterialsHBC-US INCDoxel, Inc.Boulder AssociatesCupixATS Products, IncMayair IncSchneider Electric IT CorpSourceBlue LLCFluor Enterprises IncCamfil Clean Air SolutionsPiller Power Systems Inc.Hexagon Lifecycle IntelligenceArcadisABBSiemens Smart InfrastructureElectraMetCFO ServicesVictaulic
Highlights from the Semiconductor Plant Design, Engineering & Construction Summit
200+
Senior Attendees
2
Days of Content
20+
Industry Speakers
Request a Brochure
Get comprehensive information about the 7th U.S. Semiconductor Fab Design, Engineering & Construction Summit — including the full agenda, speaker lineup, topics, networking schedule, and registration details.
You will receive instant access to the brochure right after filling out the form.
Registration
Hotel accommodation and travel costs are not included in the registration fee. Venue information will be posted on the website once confirmed — registered delegates will be notified by email.
Delegate
Applicable for: Semiconductor Manufacturing, Government Bodies, Semiconductor Associations, Universities and Research Facilities
Standard: $1,450 USD
$750
Early Bird — Until 2 April 2026
- 2-Day Conference Pass
- Documentation Package
- Panel Discussions
- Refreshment Breaks & Lunches
- Drinks Reception
- Face-to-Face Networking
- Digital Certificate of Attendance
Solution Provider
Applicable for: Design of Fab/plants/facilities, Engineering and construction, Project management, Plant automation, HVAC, Filtration, Digital twin technology, Energy providers, Construction materials/equipment
Standard: $2,750 USD
$2,250
Early Bird — Until 2 April 2026
- 2-Day Conference Pass
- Documentation Package
- Panel Discussions
- Refreshment Breaks & Lunches
- Drinks Reception
- Face-to-Face Networking
- Digital Certificate of Attendance
10%
3 Attendees
15%
4 Attendees
20%
5+ Attendees
Team discounts apply when three or more delegates from one company book and pay at the same time. To register please send your details to [email protected]
Sponsorship Opportunities
The 7th U.S. Semiconductor Fab Design, Engineering & Construction Summit provides an excellent platform to elevate your company's profile within the semiconductor manufacturing and facility infrastructure sector, showcase your innovative solutions, and enable high-value networking with key decision-makers.
The Summit Provides
a Platform to:
Showcase. Connect. Lead.
a Platform to:
Showcase. Connect. Lead.
Direct C-Suite Access
Connect with senior executives, plant managers, and key decision-makers driving major semiconductor fab projects across the United States.
Brand Visibility & Credibility
Position your brand alongside industry leaders where your solutions are presented to a highly targeted, pre-qualified audience of fab professionals.
Market Intelligence
Gain real-time insights into industry trends, procurement priorities, and project pipelines from executives leading next-generation fab development.
Premium Experience
Our focused format guarantees every partner receives dedicated attention, prime visibility, and comprehensive support to maximise return on investment.
Thought Leadership
Align your organisation with the visionaries shaping the future of U.S. semiconductor manufacturing and driving meaningful industry conversations.
Technology Showcase
Present your innovations to an audience actively seeking cutting-edge solutions for semiconductor manufacturing, fab construction, and facility operations.
Exhibiting Partner Package
What's Included
- Exhibition stand space (1–2 roll-up banners in the networking area)
- 2 Delegate passes — full conference access
- Logo & company text in all conference materials, agenda, social media posts, and marketing emails
- Conference documentation package — all speaker presentations
Early Bird Price
Standard: $9,000 USD
$6,000
Until 2 April 2026
More Sponsorship Packages Available
We offer a range of sponsorship tiers — from presenting partner and coffee-break sponsor to lanyards sponsor and business partner — each designed to match different visibility goals and budgets. Contact us to discuss the right package for your company.
Interested in Speaking?
Saw Myat Nwe
International Conference Producer
TEL: +420774146755
[email protected]
[email protected]
Testimonials from Our Past Participants
Hear directly from past attendees as they share their experiences, insights, and key takeaways — from networking opportunities to thought-provoking sessions led by industry experts.
Fernando Garcia
Arizona Commerce Authority
Executive Vice President of International Trade and Investment
Robert Harris
JH Kelly, LLC
Executive Vice President
Steve Duda
Day & Zimmermann
Sr. Director, Strategic Accounts
Jason Dollarhide
Hodess Cleanrooms
Director of Business Development
From Previous Semiconductor Fab Design, Engineering & Construction Summits
Highlights from our previous summits — connecting the semiconductor fab design and construction community across multiple editions.
Panel Discussion
Networking Break
Keynote Session
Exhibition Area
Audience
Delegate Networking
Drinks Reception
Speaker Session
Delegate Discussions
Registration
Networking
Coffee Break
