The U.S. semiconductor industry is expanding rapidly. As a result, companies across America are investing heavily in new chip manufacturing facilities, cleanrooms, automation systems, and sustainable infrastructure. The 7th U.S. Semiconductor Fab Design, Engineering & Construction Summit USA 2026 will bring together industry leaders, construction experts, technology providers, and engineering professionals in Washington, DC, on 24–25 June 2026. The summit will focus on advanced semiconductor fab design strategies, modular construction, smart manufacturing, cleanroom operations, HVAC systems, and long-term sustainability.

Leading Event Partners Supporting Semiconductor Fab Design in the USA

The future of semiconductor fab design depends on collaboration between construction firms, automation providers, material manufacturers, and cleanroom technology specialists. Therefore, the summit highlights companies that are helping improve semiconductor manufacturing infrastructure across the United States. Additionally, these partners support innovation, operational efficiency, energy management, and next-generation facility development.

Modutek Corporation – Bronze Sponsor

Founded in 1980 in San Jose, California, Modutek Corporation delivers advanced wet process equipment for semiconductor manufacturing facilities. The company designs wet benches, chemical handling systems, wafer-processing equipment, and precision cleaning technologies for high-tech production environments. Moreover, Modutek focuses heavily on in-house engineering and integrated manufacturing systems. This approach helps improve semiconductor fab design by increasing wafer processing efficiency and reducing operational risks. Over the years, the company has expanded from component production into complete wet processing solutions. Therefore, Modutek continues supporting semiconductor manufacturers that require reliable, scalable, and high-performance fabrication systems across modern U.S. semiconductor facilities.

Horizon Roofing, Inc. – Exhibition Partner

Horizon Roofing, Inc. started operations in 1983 in Cedar Hill, Texas. The company specializes in commercial flat roofing systems for industrial and technology-driven facilities. Additionally, Horizon Roofing provides Rubber, TPO, PVC, BUR, and Modified BIT roofing solutions for large-scale commercial projects. In semiconductor fab design, durable roofing systems play a major role in protecting cleanroom environments and sensitive manufacturing operations. Therefore, Horizon Roofing supports long-term infrastructure stability for semiconductor plants across the United States. The company also maintains a strong reputation for quality service and customer satisfaction. As semiconductor facility investments continue growing nationwide, reliable construction partners remain extremely important.

RoviSys Company – Exhibition Partner

RoviSys Company was founded in 1989 and became one of North America’s earliest control systems integration companies. Headquartered in Aurora, Ohio, the company now provides advanced automation services across the United States and Asia Pacific. Furthermore, RoviSys combines modern digital technologies with existing industrial systems to improve operational efficiency and process visibility. Semiconductor fab design now depends heavily on automation, predictive monitoring, and real-time process control. Therefore, RoviSys supports semiconductor facilities through intelligent automation strategies and integrated manufacturing solutions. Its expertise also helps semiconductor companies improve productivity, reduce downtime, and modernize facility operations within highly advanced chip manufacturing environments.

ATS Duct Inc. – Exhibition Partner

Founded in 1971 and headquartered in Richmond, California, ATS Duct manufactures FM-Approved fiberglass reinforced plastic duct systems and piping technologies. The company serves semiconductor, aerospace, pharmaceutical, wastewater, and cleanroom industries around the world. Moreover, ATS Duct develops conductive StaticSafe Duct systems and modular joining technologies that improve airflow performance and contamination control. In semiconductor fab design, maintaining clean environments is critical because even small contaminants can affect chip production quality. Therefore, ATS Duct helps semiconductor facilities maintain cleanroom stability and operational safety. Its specialized duct systems also support high-performance airflow management in modern semiconductor manufacturing plants.

Vestis Corporation – Exhibition Partner

Vestis Corporation, formerly known as Aramark Uniform Services, operates as a leading North American workplace solutions provider. The company delivers cleanroom garments, workplace uniforms, floor mats, towels, restroom products, and first aid supplies to businesses across multiple industries. Furthermore, Vestis supports organizations ranging from small businesses to Fortune 500 companies. Semiconductor fab design requires strict contamination control and cleanroom management practices. Therefore, Vestis helps semiconductor manufacturers maintain clean, safe, and compliant production environments. The company’s cleanroom garment processing services also support workforce hygiene standards within semiconductor manufacturing facilities. As a result, Vestis continues playing an important role in operational readiness and workplace efficiency.

Heidelberg Materials – Panelist Partner

Heidelberg Materials, headquartered in Heidelberg, Germany, ranks among the world’s largest building materials companies. The company operates in nearly 50 countries and employs approximately 49,000 people globally. Additionally, Heidelberg Materials produces cement, aggregates, ready-mixed concrete, and asphalt for large infrastructure projects worldwide. Sustainability now influences every stage of semiconductor fab design because fabrication facilities require massive energy and construction resources. Therefore, Heidelberg Materials supports low-carbon construction practices and circular building solutions that align with modern sustainability goals. The company also focuses strongly on Net Zero initiatives. As semiconductor infrastructure development grows across America, sustainable construction materials will become increasingly valuable.

HITT Contracting – Networking Drinks Partner

HITT Contracting began in 1937 as a small painting business in Arlington, Virginia. Today, the company operates as one of the leading general contractors in the United States. Moreover, HITT manages projects ranging from commercial interiors to multi-billion-dollar data center campuses and mission-critical infrastructure developments. Semiconductor fab design requires precision construction, coordinated project execution, and highly controlled environments. Therefore, HITT brings valuable expertise to advanced semiconductor facility projects across the country. The company also uses data-driven project management strategies to improve efficiency and reduce delays. As semiconductor manufacturing investments continue rising in the U.S., experienced construction partners remain essential for successful facility development.

Why the Summit Matters for the U.S. Semiconductor Industry

The 7th U.S. Semiconductor Fab Design, Engineering & Construction Summit USA 2026 will cover major industry topics, including digital twins, AI-driven manufacturing, modular construction, advanced HVAC systems, thermal management, water recycling, and workforce development. Additionally, the summit will connect decision-makers, engineering leaders, automation experts, and construction professionals from across the semiconductor ecosystem.

The event also reflects the growing importance of semiconductor fab design in supporting America’s domestic chip manufacturing goals. As the CHIPS Act drives new investments nationwide, companies must build facilities that deliver scalability, efficiency, sustainability, and operational resilience.

To Sum Up

The event partners at the 7th U.S. Semiconductor Fab Design, Engineering & Construction Summit USA 2026 represent key sectors driving the future of semiconductor manufacturing infrastructure. From automation and cleanroom solutions to sustainable construction and commercial engineering, every partner contributes to stronger semiconductor fab design strategies across the United States. The summit will take place on 24–25 June 2026 in Washington, DC, bringing together top semiconductor leaders, facility experts, and technology innovators. If you want to stay ahead in semiconductor manufacturing, this summit is a valuable event to attend.