9th High-Density AI Data Center Cooling & Thermal Management — Dallas 2026
9th Edition Annual Industry Conference  ·  Dallas, TX USA

High-Density AI Data Center
Cooling & Thermal Management

Dates 18 – 19 August 2026
Location Dallas, TX USA
Audience C-Level & Senior Leaders
Co-located Event — Dallas 2026
Co-located Event
18 – 19 August 2026
Dallas, TX USA — Same venue
Learn More
About the Event — 9th High-Density AI Data Center Cooling & Thermal Management

Where Real-World
Cooling Challenges
Get Solved

As AI workloads push rack densities to unprecedented levels, cooling has become the defining constraint in data center design and operations.

The industry is now moving beyond theoretical design into large-scale deployment, where real-world challenges are emerging. Operators are dealing with commissioning delays, CDU failures, leak risks, unstable performance under load, and retrofit strategies that do not perform as expected.

GPU-based infrastructure introduces fundamentally different thermal behaviour compared to traditional computing. Higher and more concentrated heat loads, rapid workload variability, and increasing rack densities are reshaping cooling system requirements.

Set in Dallas, TX, the event addresses performance under sustained high ambient temperatures, water constraints, and ERCOT-driven infrastructure considerations — bringing regional operating realities into the core of the agenda.

9th
Annual Edition
2
Conference Days
12
Key Topics
Conference Tracks
01

Real-World Deployment & Performance Gaps

CDU failures, commissioning delays, integration breakdowns, and the gap between design assumptions and live operation at scale.

02

Managing AI-Driven Thermal Demands

GPU-dense heat management, thermal intelligence, predictive control systems, and cooling operations under water constraints.

03

Scaling Cooling Infrastructure & System Design

Cooling AI architecture, cost-effective infrastructure, and whether current systems can keep pace with AI workload demands.

04

Power, Water & Energy Constraints at Scale

Extreme Dallas conditions, heat rejection bottlenecks in high ambient environments, and navigating ERCOT grid constraints.

Join industry experts to explore the realities of deploying and operating cooling systems at scale — what works, what fails, and what needs to change.
Networking — 9th High-Density AI Data Center Cooling & Thermal Management
Business Networking

Networking
Opportunities

Future Bridge is proud to offer ample networking opportunities designed to foster meaningful connections and facilitate interactions among attendees.

Pre-arranged 1-to-1 face meetings, an evening drinks reception, and up to 6 hours of structured networking built across both conference days.

The agenda includes a networking break featuring pre-arranged 1-to-1 face meetings during a Coffee and Ice-breaking session. Participants will have the opportunity to engage in focused discussions, exchange ideas, and establish new relationships in a relaxed and informal setting.

01
Mobile App for Delegate Connections
Connect with peers before, during, and after the event through the dedicated conference app.
02
Up to 6 Hours of Networking Breaks
Structured and informal networking built into every corner of the two-day programme.
03
Drinks Reception for Delegate Networking
End Day One with a dedicated evening reception — the ideal setting for lasting industry relationships.
04
Facilitated Peer-to-Peer Networking
Guided formats ensuring every delegate has multiple high-quality interaction opportunities.
05
Post-Event Communication
Continued access to delegate profiles and communication tools after the summit concludes.
Topics to be Discussed — 9th High-Density AI Data Center Cooling & Thermal Management

Topics to be Discussed

6
of 12 Topics
Beyond Design: Real-World Deployment & Performance Gaps
01
When Design Meets Reality: Lessons for High-Density AI Deployments
  • CDU failures, leak risks, and integration breakdowns in live environments
  • Commissioning delays and multi-vendor coordination challenges
  • Performance gaps between design assumptions and real operation
02
Cooling Systems Under Stress: Performance at Full Load
  • Transient load response and system instability risks
  • Control system limitations during rapid workload shifts
  • Observed vs modelled cooling performance gaps
  • Thermal excursions and recovery challenges
03
Retrofitting Legacy Facilities for Next-Generation Workloads
  • Upgrading legacy facilities with modern cooling and power systems
  • Thermal zoning to isolate high-density racks from traditional loads
  • Techniques for reducing mechanical/electrical losses in older sites
  • Phased retrofit strategies to maintain uptime and operational continuity
Constraints at Scale: Power, Water & Energy Interplay
05
Operating in Extreme Conditions: Lessons from Dallas Data Centers
  • Sustained high ambient temperatures and cooling efficiency impact
  • Policy for Water & Electricity sourcing
  • Designing systems for peak summer performance, not averages
  • Regional considerations shaping infrastructure decisions
06
Heat Rejection Bottlenecks in High Ambient Environments
  • Managing Cooling tower and dry cooler performance at >35°C
  • Challenges in exporting or repurposing waste heat
  • Exploring Thermal Energy Storage as a strategy for load shifting
  • System derating and loss of capacity during peak heat events
07
Power Meets Cooling: Navigating ERCOT Constraints
  • Grid limitations and their impact on cooling system design
  • Load curtailment scenarios and thermal risk exposure
  • Interdependency between electrical and thermal resilience
  • Operational decision-making in constrained grid environments
  • Integrating BESS to support cooling loads and manage grid constraints
Sponsors — 9th High-Density AI Data Center Cooling & Thermal Management
Partners

Our Sponsors

Companies showcasing their solutions at the 9th High-Density AI Data Center Cooling & Thermal Management Summit.

Exhibiting Partner
Visit Website
Who Should Attend — 9th High-Density AI Data Center Cooling & Thermal Management
Attendance Profile

Who Should
Attend?

C-Level Officers, Vice-Presidents, Directors, Leads, Managers and Heads responsible for data center operations, cooling, and infrastructure.

Roles & Responsibilities

Senior leaders across operations, technology, engineering, and infrastructure planning from data center operators and solution providers.

Operations Technology Thermal Management Engineering Infrastructure Planning Critical Infrastructure Mission Critical Facilities Facility Design & Construction Commissioning Systems Integration Cooling Systems HVAC Engineering Water Management Energy Management Capacity Planning Automation
Industries Represented
Data Center Operators
Cooling Solutions
Thermal Management
HVAC Services
Heat Rejection Systems
Water Management
DC Design & Construction
Critical Infrastructure
GPU Manufacturers
Energy Efficiency
Hardware & Equipment
IT Services
Direct Benefits
01
Stay Ahead of Industry Trends
Gain cutting-edge insights into GPU-driven thermal behaviour, AI workload demands, and next-generation cooling architectures.
02
Exclusive Networking Opportunities
Connect face-to-face with C-level officers, VPs, and directors from the world's leading data center operators and engineering firms.
03
Interactive Learning with Experts
Engage directly with operators and engineers solving real deployment challenges — CDU failures, retrofit strategies, and ERCOT constraints.
04
Build Valuable Connections
A drinks reception and up to 6 hours of structured networking across both conference days.
Video Testimonials — 9th High-Density AI Data Center Cooling & Thermal Management
Previous Editions

Video Testimonials

Hear directly from past attendees and speakers — their experiences, insights, and key takeaways from previous editions.

Sponsorship Opportunities — 9th High-Density AI Data Center Cooling & Thermal Management
Partner With Us

Sponsorship Opportunities

Elevate your brand and connect with 100+ senior data center decision-makers. Limited packages available — contact us today.

Why Sponsor?

The 9th High-Density AI Data Center Cooling & Thermal Management provides an excellent platform to elevate your company's profile, showcase your innovative solutions, and enable high-value networking with key decision-makers across the data center cooling and thermal management sector.

Direct Benefits
Direct C-Suite Access
Connect face-to-face with C-Level Officers, VPs, Directors, and Heads responsible for DC cooling, thermal management, engineering, and infrastructure across the industry.
Brand Visibility
Your logo and company profile featured across the conference agenda, social media, marketing emails, brochures, and all printed and digital materials in front of a pre-qualified audience.
Thought Leadership
Dedicated vendor sessions give you a speaking slot to present your solutions directly to decision-makers, positioning your brand as a leading voice in AI data center cooling innovation.
Technology Showcase
Present your innovations to an audience actively seeking solutions for data center cooling, heat rejection, thermal management, water systems, and AI-ready facility design.
Market Intelligence
Gain real-time insights into data center cooling priorities — GPU-driven thermal demands, liquid cooling adoption, ERCOT constraints, water restrictions, and retrofit strategies.
Exclusive Networking
Up to 6 hours of structured networking, facilitated 1-to-1 meetings, an evening drinks reception, and a mobile app — all designed to ensure every conversation counts.
Exhibition Area — Previous Editions
Exhibition area
Networking
Exhibition
Exhibition booth
Delegates
Interested in Sponsoring?
Sponsorship
Enquiries

We offer a range of sponsorship tiers — from presenting partner to exhibition stand — each designed to match different visibility goals and budgets.

View All Packages  →
Andrea Olsson
Marketing Manager
Request a Brochure — 9th High-Density AI Data Center Cooling & Thermal Management

Request a Brochure

Get comprehensive information about the summit — speakers, full agenda, session topics, networking schedule, and sponsorship packages.

(Request Form) 9th High-Density AI Data Center Cooling & Thermal Management Summit
(Access Code) 9th High-Density AI Data Center Cooling & Thermal Management Summit
Registration — 9th High-Density AI Data Center Cooling & Thermal Management
Join the Summit

Register Now

Delegate
End-User
Applicable for: Data centers owners/users
Standard Price
2 299 USD
Discounted price until
May 28th, 2026
1 Delegate99 USD
2 Delegates159 USD
3 Delegates259 USD
2-Day Conference Pass
Documentation Package
Panel Discussions
Refreshment Breaks & Lunches
Drinks Reception
Face To Face Networking
Digital Certificate Of Attendance
Register via Email →
Delegate
Construction & Engineering
Applicable for: General contractors, EPC firms, MEP contractors, structural engineers, project management consultancies, and design & engineering firms involved in data centre construction
Standard Price
2 499 USD
Discounted price until
May 28th, 2026
1 399 USD
2-Day Conference Pass
Documentation Package
Panel Discussions
Refreshment Breaks & Lunches
Drinks Reception
Face To Face Networking
Digital Certificate Of Attendance
Register Now →
Delegate
Solution Provider
Applicable for: DC Facility Management, Cooling Technologies, Thermal Management, Heat Rejection & HVAC, Systems Integration, DC Design, Engineering & Construction, Water & Utilities
Standard Price
3 299 USD
Discounted price until
May 28th, 2026
1 550 USD
2-Day Conference Pass
Documentation Package
Panel Discussions
Refreshment Breaks & Lunches
Drinks Reception
Face To Face Networking
Digital Certificate Of Attendance
Register Now →
Partner
Exhibition Partner
Applicable for: Companies wishing to showcase products and services with a dedicated exhibition stand
Standard Price
11 900 USD
Discounted price until
May 28th, 2026
7 000 USD
Exhibition stand
2 delegate passes
Logo & company text in all conference materials
Conference documentation package
Register Now →
Event Highlights — 9th High-Density AI Data Center Cooling & Thermal Management
Previous Editions

Event Highlights

Relive the best moments from our previous summits — keynotes, panel discussions, and networking from past editions.

Testimonials — 9th High-Density AI Data Center Cooling & Thermal Management
Attendee Feedback

What Attendees Say

Hear directly from professionals who experienced the event — their insights, connections, and key takeaways.

"

Fantastic, perfect balance of networking and education in an open, honest setup. The process were excellent.

Anew Climate LLC
Faizal Hassan — Vice President, Environmental Products
"

Really good well organized event. Presenters dinner was a nice touch, networking sessions interactive & plentiful.

Group CBS
Steve Camber — Vice President of Business Development
"

Amazing, very well planned. Great group of sessions and presenters.

Vantage Data Centers
Namrata Gupta — Sustainability Manager
"

The attendance of this event made it well worth it — in particular, the sustainability directors from data center companies.

Schneider Electric USA
Alexander Rakow — Director of Sustainability, Data Centers
"

Great balance between information and networking.

CheckSammy
Jonathan Jaovanni — Account Executive, National Sales
"

Amazing! Really enjoyed the smaller size and ample encouragement and time for networking.

Carbon Direct
Eva Guadamillas — Client Engagement Manager
"

Very positive. I found the networking breaks to be incredibly helpful, and was able to absorb a lot of new information about the data center industry.

Enterprise Sales
Stephanie White — Enterprise Sales Executive
"

Nice on the smaller side, but well-run and the ability to easily approach people for conversation.

Gensler
Chris Sanders — Associate
"

Fantastic group of presenters – great networking.

Gensler
Ryan Jensen — Senior Associate
"

Very informative, learned a lot about the energy side of data centers.

Industrial Info Resources
Angela Hudson — North America Research Manager
"

I really enjoyed the conversations & learning more about the data center realm.

Calpine Energy Solutions
Alexandria Pedrin — Business Development
"

Well organized and great range of topics discussed. Smaller size made it good for networking and connecting with all speakers.

T-Mobile
Sean Seemann — Sr. Engineer, System Architecture
"

Great event. Very informative speakers. Very well run.

T-Mobile
Henry Zielinski — Director, Critical Facility Operations
1 / 5
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