Semiconductor Facilities, Operations & Expansion. The definitive gathering of manufacturers, fab owners, EPC contractors, engineers and technology providers delivering America's advanced fabs, faster.
About the Event
Engineering the Facilities Behind America's Chip Supply
The 8th Semiconductor Design, Construction & Engineering Summit brings together semiconductor manufacturers, fab owners, EPC contractors, engineers, technology providers and industry leaders to address the challenges and opportunities shaping the next generation of U.S. chip manufacturing.
As domestic manufacturing capacity continues to expand, the industry faces increasing pressure to deliver advanced facilities faster, strengthen supply chains, secure skilled talent, and build the resilient infrastructure required to support increasingly sophisticated production environments. From advanced packaging and High-NA EUV readiness to mega-fab project execution, utility infrastructure and cleanroom engineering, organisations are rethinking how semiconductor facilities are designed, constructed and commissioned.
Taking place in Phoenix, Arizona — one of the world's most dynamic semiconductor hubs — the summit provides a platform for sharing practical insights, lessons learned and proven strategies for achieving engineering excellence and successful project delivery. Through expert-led discussions and peer-to-peer exchange, attendees will gain valuable perspectives on the priorities defining the future of semiconductor manufacturing.
Program Highlights
- Mega-Fab Construction & Delivery
- AI & HBM Manufacturing
- Advanced Packaging
- High-NA EUV Readiness
- Fab Expansion & Construction
- Supply Chain Resilience
- Manufacturing Equipment Integration
- Facility Operations & Ramp-Up
- Digital Twins & Yield Improvement
- Capital Project Optimisation
- Cleanrooms & Environmental Control
- Critical Utilities & Infrastructure
- Power & Energy Resilience
- Water Management & Sustainability
- Brownfield Expansion & Retrofits
- Compliance & Risk Management
- Workforce Development
- U.S. Semiconductor Growth & Competitiveness
Program Highlights
Topics to Be Discussed
Comprehensive coverage of the most critical challenges and innovations shaping semiconductor facility design, construction and operations.
A
Mega-Fab Construction & Project Delivery
- How can semiconductor mega-fab projects be delivered faster while maintaining quality, safety and operational performance?
- What project delivery models best reduce cost overruns and schedule delays?
- How can organizations improve capital project governance across large-scale investments?
B
AI & HBM Manufacturing
- How are AI-driven semiconductor investments reshaping fab design and construction?
- What infrastructure is required to support high-bandwidth memory manufacturing?
- What manufacturing challenges will define the next generation of AI chip production?
C
Advanced Packaging & Future Manufacturing
- What facility requirements are needed to scale advanced packaging?
- How should fabs prepare for High-NA EUV implementation?
- How can facilities remain flexible for future technology nodes?
D
Facility Operations, Commissioning & Ramp-Up
- How can semiconductor facilities achieve faster production ramp-up?
- What best practices ensure successful commissioning and operational readiness?
- What strategies reduce startup risks for new fabs?
E
Digital Manufacturing & Yield Improvement
- How are digital twins transforming semiconductor facilities?
- How can AI and smart manufacturing improve production yield?
- What role does predictive maintenance play in fab performance?
F
Cleanrooms & Critical Infrastructure
- How can cleanroom environments meet increasingly demanding requirements?
- What HVAC innovations improve contamination control?
- How can humidity control maximize yield and process stability?
G
Power, Water & Sustainable Infrastructure
- How can manufacturers secure reliable power for future expansion?
- What strategies improve energy resilience and reduce operational risk?
- How can facilities reduce water consumption while maintaining quality?
H
Brownfield Expansion & Fab Modernization
- How can existing fabs be expanded without disrupting production?
- What are the biggest challenges in modernizing aging facilities?
- What strategies minimize operational risks during expansion projects?
I
Supply Chain, Risk & Workforce
- How can semiconductor manufacturers strengthen supply chain resilience?
- What strategies reduce project risk across major capital investments?
- How can organizations attract and retain skilled talent?
C-Suite & Executives
Directors & VPs
Heads & Managers
Who Should Attend
Built for the Teams Delivering U.S. Fabs
From C-suite executives to directors, heads and managers — the summit brings together every function responsible for designing, building and operating America's semiconductor facilities.
Engineering
Construction
Design
Facilities
Operations
Planning
Energy Efficiency
Supply Chain
Asset Management
Projects
Capital Strategy
Semiconductor Manufacturing
Fab Construction
Project Delivery
Advanced Packaging
Procurement
Technology Development
Power & Utilities
Water Management
Site Selection
Infrastructure Development
Workforce Development
Government Affairs & Policy
Investment & Strategy
R&D Innovation
Industries Represented
- Semiconductor Manufacturers & Foundries
- Integrated Device Manufacturers (IDMs)
- Advanced Packaging & Test Providers
- Fabless Semiconductor Companies
- Construction & EPC Contractors
- Architecture, Engineering & Design Firms
- Semiconductor Equipment Manufacturers
- Material & Chemical Suppliers
- Utilities & Energy Providers
- Water Infrastructure Companies
- Technology & Automation Providers
- EDA & Semiconductor Design Software
- Federal, State & Local Government
- Private Equity & Infrastructure Investors
- Supply Chain & Logistics Providers
Business Networking
Ample Opportunities, By Future Bridge
Future Bridge is proud to offer ample networking opportunities during our event. The agenda includes networking breaks featuring face-to-face meetings during coffee and ice-breaking sessions, designed to foster meaningful connections and facilitate interactions among attendees.
Mobile App for Delegate Connections
Connect with fellow delegates before, during, and after the event via the dedicated conference app.
Up to 6 Hours of Networking Breaks
Extensive dedicated networking time structured throughout both conference days.
Facilitated Peer-to-Peer Networking
Structured sessions connecting delegates with complementary interests and expertise.
Drinks Reception
Evening reception providing an informal setting to continue conversations and build lasting relationships.
Post-Event Communication
Continued connection facilitation after the event to ensure lasting value from every relationship established.
From Previous Summits
Participants will have the opportunity to engage in focused discussions, exchange ideas, and establish new relationships during both structured sessions and informal breaks throughout the two-day program.
Secure Your PlaceOur Sponsors
Trusted by Industry Partners
Exhibiting Partner
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Direct Benefits
Don't Miss This Opportunity
Gain cutting-edge knowledge and connect with industry innovators shaping the future of semiconductor manufacturing.
01
Build Valuable Connections
Engage directly with the manufacturers, EPC contractors and engineers driving America's fab expansion.
02
Stay Ahead Of Industry Trends
Get the latest perspectives on AI manufacturing, High-NA EUV readiness and advanced packaging.
03
Interactive Learning With Experts
Learn directly from engineers, architects and project leaders delivering U.S. mega-fabs.
04
Exclusive Networking Opportunities
Access curated sessions designed for meaningful introductions across the facilities value chain.
Previous Series Attendees & Sponsors
3D-Micromac America, LLC
ABM
American BIM Construction
Amkor Technology
Analog Devices
Applied Materials
Arizona Commerce Authority
Arizona State University
ASM
Austin Commercial
Brian Culhane Consulting Engineers
Cleanroom Construction Associates
Coherent Corp
Commercial Contracting Corporation
Diamondback Design Group
Empire State Development
Enterprise Ireland
EUV Tech
Foresight
HanmiGlobal USA, Inc.
Hensel Phelps
Hitachi Energy
Integra Technologies
Intel
K Ensol USA
KP Link
MACOM Technology Solutions
Meta
Micromize
Micron Technology
3D-Micromac America, LLC
ABM
American BIM Construction
Amkor Technology
Analog Devices
Applied Materials
Arizona Commerce Authority
Arizona State University
ASM
Austin Commercial
Brian Culhane Consulting Engineers
Cleanroom Construction Associates
Coherent Corp
Commercial Contracting Corporation
Diamondback Design Group
Empire State Development
Enterprise Ireland
EUV Tech
Foresight
HanmiGlobal USA, Inc.
Hensel Phelps
Hitachi Energy
Integra Technologies
Intel
K Ensol USA
KP Link
MACOM Technology Solutions
Meta
Micromize
Micron Technology
Monastic Academy
Mountain West Industrial
Munters Corporation
NXP Semiconductors
NY CREATES
Prairie View A&M University
Prime Controls LP
SCI Fabrication
SEMI Foundation
Samsung Electronics
Sensitron Semiconductor
Sherwin Williams Company
SK hynix Inc.
Solidigm
STMicroelectronics
Suffolk
SUMCO USA
Texas Instruments
The University of Texas at Austin
TSMC Arizona Corporation
Wolfspeed
X-Fab Texas
JH Kelly, LLC BrandSafway
Bechtel Manufacturing & Technology
Hodess Cleanrooms
ALICE Technologies
TECHspace
Day & Zimmermann
Kaeser Compressors, Inc
Pinnacle Infotech Inc.
McKinsey
Monastic Academy
Mountain West Industrial
Munters Corporation
NXP Semiconductors
NY CREATES
Prairie View A&M University
Prime Controls LP
SCI Fabrication
SEMI Foundation
Samsung Electronics
Sensitron Semiconductor
Sherwin Williams Company
SK hynix Inc.
Solidigm
STMicroelectronics
Suffolk
SUMCO USA
Texas Instruments
The University of Texas at Austin
TSMC Arizona Corporation
Wolfspeed
X-Fab Texas
JH Kelly, LLC BrandSafway
Bechtel Manufacturing & Technology
Hodess Cleanrooms
ALICE Technologies
TECHspace
Day & Zimmermann
Kaeser Compressors, Inc
Pinnacle Infotech Inc.
McKinsey
Trane
PPG Industries, Inc.
Highwire
Roxtec USA
Cleanrooms West
Okland Construction
Sears Gerbo Architecture
SMRT Architects and Engineers
Clark Pacific
Garney Construction
Carlisle Construction Materials
HBC-US INC
Doxel, Inc.
Boulder Associates
Cupix
ATS Products, Inc
Mayair Inc
Schneider Electric IT Corp
SourceBlue LLC
Fluor Enterprises Inc
Camfil Clean Air Solutions
Piller Power Systems Inc.
Hexagon Lifecycle Intelligence
Arcadis
ABB
Siemens Smart Infrastructure
ElectraMet
CFO Services
Victaulic
Trane
PPG Industries, Inc.
Highwire
Roxtec USA
Cleanrooms West
Okland Construction
Sears Gerbo Architecture
SMRT Architects and Engineers
Clark Pacific
Garney Construction
Carlisle Construction Materials
HBC-US INC
Doxel, Inc.
Boulder Associates
Cupix
ATS Products, Inc
Mayair Inc
Schneider Electric IT Corp
SourceBlue LLC
Fluor Enterprises Inc
Camfil Clean Air Solutions
Piller Power Systems Inc.
Hexagon Lifecycle Intelligence
Arcadis
ABB
Siemens Smart Infrastructure
ElectraMet
CFO Services
Victaulic
Event Highlights
Highlights from the Semiconductor Plant Design, Engineering & Construction Summit
200+
Senior Attendees
2
Days of Content
20+
Industry Speakers
Request the Brochure
Get the Full Agenda
Access the complete programme — topics, format details, sponsorship packages and registration information for the 8th U.S. Semiconductor Summit.
Step 1
Step 2
Registration
Secure Your Place in Phoenix
Hotel accommodation and travel costs are not included in the registration fee.
Discounted pricing valid until July 23, 2026
Delegate | End-User
Applicable for: Semiconductor Manufacturing, Government Bodies, Semiconductor Associations, Universities and Research Facilities
Standard: $2,299
$1,199
- 2-Day Conference Pass
- Documentation Package
- Panel Discussions
- Refreshment Breaks & Lunches
- Drinks Reception
- Face-to-Face Networking
- Digital Certificate of Attendance
Delegate | Solution Provider
Applicable for: Fab/facility design & engineering, Construction, Automation, HVAC & environmental control, Contamination & cleanroom solutions, Humidity control & filtration, Monitoring systems, Digital twin technology, Construction materials & equipment, Energy & storage solutions
Standard: $3,299
$1,499
- 2-Day Conference Pass
- Documentation Package
- Panel Discussions
- Refreshment Breaks & Lunches
- Drinks Reception
- Face-to-Face Networking
- Digital Certificate of Attendance
Delegate | Construction & Engineering
Applicable for: General contractors, EPC firms, MEP contractors, structural engineers, project management consultancies.
Standard: $2,499
$1,299
- 2-Day Conference Pass
- Documentation Package
- Panel Discussions
- Refreshment Breaks & Lunches
- Drinks Reception
- Face-to-Face Networking
- Digital Certificate of Attendance
10%
3 Attendees
15%
4 Attendees
20%
5+ Attendees
Team discounts apply when three or more delegates from one company book and pay at the same time. To register please send your details to [email protected]
Sponsorship Opportunities
The 8th U.S. Semiconductor Design, Construction & Engineering Summit provides an excellent platform to elevate your company's profile within the semiconductor manufacturing and facility infrastructure sector, showcase your innovative solutions, and enable high-value networking with key decision-makers.
The Summit Provides
a Platform to:
Showcase. Connect. Lead.
a Platform to:
Showcase. Connect. Lead.
Direct C-Suite Access
Connect with senior executives, plant managers, and key decision-makers driving major semiconductor fab projects across the United States.
Brand Visibility & Credibility
Position your brand alongside industry leaders where your solutions are presented to a highly targeted, pre-qualified audience of fab professionals.
Market Intelligence
Gain real-time insights into industry trends, procurement priorities, and project pipelines from executives leading next-generation fab development.
Premium Experience
Our focused format guarantees every partner receives dedicated attention, prime visibility, and comprehensive support to maximise return on investment.
Thought Leadership
Align your organisation with the visionaries shaping the future of U.S. semiconductor manufacturing and driving meaningful industry conversations.
Technology Showcase
Present your innovations to an audience actively seeking cutting-edge solutions for semiconductor manufacturing, fab construction, and facility operations.
Exhibiting Partner Package
What's Included
- Exhibition stand space (1–2 roll-up banners in the networking area)
- 2 Delegate passes — full conference access
- Logo & company text in all conference materials, agenda, social media posts, and marketing emails
- Conference documentation package — all speaker presentations
Discounted Until July 23, 2026
Standard: $11,900
$7,900
Presenting Partner Package
What's Included
- Speaker slot on the main conference program
- 1 Speaker attendee pass
- Logo & company text in all conference materials
- Conference documentation package — all speaker presentations
Discounted Until July 23, 2026
Standard: $11,900
$8,900
More Sponsorship Packages Available
A range of sponsorship tiers is available — including the Presenting Partner package — each designed to match different visibility goals and budgets. Contact us to discuss the right package for your company.
Interested in Speaking?
Vaishnavi Yerramsetty
Conference Producer
TEL: +420 292 331 351
[email protected]
[email protected]
Testimonials
What Past Attendees Say
Hear from attendees of previous Future Bridge semiconductor summits as they share their experiences, insights and key takeaways — from networking opportunities to thought-provoking sessions led by industry experts.
Fernando Garcia
Arizona Commerce Authority
Executive Vice President of International Trade and Investment
Robert Harris
JH Kelly, LLC
Executive Vice President
Steve Duda
Day & Zimmermann
Sr. Director, Strategic Accounts
Jason Dollarhide
Hodess Cleanrooms
Director of Business Development
Media Gallery
From Previous Semiconductor Design, Construction & Engineering Summits
Highlights from our previous summits — connecting the semiconductor fab design and construction community across multiple editions.
Panel Discussion
Networking Break
Keynote Session
Exhibition Area
Audience
Delegate Networking
Drinks Reception
Speaker Session
Delegate Discussions
Registration
Networking
Coffee Break
